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1 - 3 of 3 Job(s)
  • Keyskills: Die Attach, Flip Chip
    Summary: Flip Chip Bonding, Die Attach, Thin Film, Overmold, Laser Lift Off, Packaging Design
    Singapore
    5-10 years
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    Posted : June 2018
  • Keyskills: Flip Chip Bonding, Die Attach
    Summary: Thin Film Flip Chip process development (Gold-Gold Interconnect (GGI), Underfill, Micro Bead Blasting, Laser Lift-Off and Electro Chemical Etch) with TSV packaging experience for a reputable semic..
    Singapore
    5-10 years
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    Posted : June 2018
  • Keyskills: Flip Chip, FMEA, SPC, APQP, PPA
    Summary: Quality Incoming and Outgoing, Wafer level, 8D, FMEA, SPC, APQP, PPAP, MSA
    Singapore
    3-8 years
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    Posted : June 2018
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