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  • Keyskills: Flip Chip Bonding, Die Attach
    Summary: Thin Film Flip Chip process development (Gold-Gold Interconnect (GGI), Underfill, Micro Bead Blasting, Laser Lift-Off and Electro Chemical Etch) with TSV packaging experience for a reputable semic..
    Singapore
    5-10 years
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    Posted : June 2018
  • Keyskills: Die Attach, Flip Chip
    Summary: Flip Chip Bonding, Die Attach, Thin Film, Overmold, Laser Lift Off, Packaging Design
    Singapore
    5-10 years
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    Posted : June 2018
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