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1 - 11 of 11 Job(s)
  • PrimeStaff Management Services Pte Ltd
    Keyskills: process engineer bonding wire
    Summary: Summary of the position: Support the Advanced Materials & Bonding Wire Biz Unit, Carry out Process Improvement Activities, related to Advanced Materials & Bonding Wire Manufacturing. Carry out..
    Singapore
    2-10 years
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    Posted : 9th Jul 2018
  • PrimeStaff Management Services Pte Ltd
    Keyskills: Direct Copper Bonding Substrate DCB
    Summary: Summary: Support the Advanced Materials & Bonding Wire Biz Unit. Drive for Continual improvement to current process. Drive for Quality improvement thro failure analysis on customer returns & p..
    Singapore
    12-16 years
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    Posted : 6th Jul 2018
  • HPS Partners Pte Ltd
    Keyskills: Flip Chip Bonding, Die Attach
    Summary: Thin Film Flip Chip process development (Gold-Gold Interconnect (GGI), Underfill, Micro Bead Blasting, Laser Lift-Off and Electro Chemical Etch) with TSV packaging experience for a reputable semic..
    Singapore
    5-10 years
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    Posted : 14th Jun 2018
  • HPS Partners Pte Ltd
    Keyskills: Die Design, Micro-bumping..., Fan out packaging, LED, Die Fab
    Summary: Die design development, Micro-Bumping, Fan out Packaging, Wafer Fab Process, Die Fab Process, Yield Analysis for FWT/AVI, Epitaxy, R&D for Die Level Development.
    Singapore
    4-9 years
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    Posted : 14th Jun 2018
  • HPS Partners Pte Ltd
    Keyskills: Wafer Finishing, Die
    Summary: Die Singulation, Back Grinding, Laser Lift-Off, PnP Technology, Process Integration, Technology transfer, Yield Engineering, Unit/Module Process Development, SPC
    Singapore
    3-8 years
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    Posted : 14th Jun 2018
  • HPS Partners Pte Ltd
    Keyskills: Die Attach, Flip Chip
    Summary: Flip Chip Bonding, Die Attach, Thin Film, Overmold, Laser Lift Off, Packaging Design
    Singapore
    5-10 years
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    Posted : 14th Jun 2018
  • HPS Partners Pte Ltd
    Keyskills: CMP, Backgrind, Die
    Summary: CMP process development engineer with Die Singulation and/or Backgrind experience. This role is for a reputable semiconductor company in Singapore.
    Singapore
    3-10 years
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    Posted : 14th Jun 2018
  • GMP Recruitment Services (S) Pte Ltd
    Keyskills: Replication
    Summary: * Develop and improve process capability to meet product design requirements. , * Support NPI and Manufacturing Engineering , * Sustain current process yield and troubleshoot any process failure..
    Singapore
    2-7 years
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    Posted : 31st May 2018
  • GMP Banking
    Keyskills: Replication
    Summary: * Develop and improve process capability to meet product design requirements. , * Support NPI and Manufacturing Engineering , * Sustain current process yield and troubleshoot any process failure..
    Singapore
    2-7 years
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    Posted : 31st May 2018
  • Singbest Human Resource Pte Ltd
    Keyskills: engineer, wirebonder, wire bonder
    Summary: Reputable MNC employer from Singapore Competitive pay and benefits A wonder platform to advance your career
    Singapore
    2-12 years
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    Posted : April 2018
  • Talent Search Pte Ltd
    Keyskills: soldering process, die attach
    Summary: Part of a global engineering team member, leading a team of process engineers to manage process improvement, product transfer, NPI and seek continuous engineering process improvement
    Singapore
    10-15 years
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    Posted : March 2018
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