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Packaging Engineer

Keywords / Skills : Flip Chip Bonding, Die Attach, Overmold, TSV Packaging, Packaging Substrate, Semiconductors, R&D

5 - 10 years
Posted: 2018-06-14

Job Description
Job Description:
  • Develop and transfer Thin Film Flip chip (TFFC) processes – Gold-Gold Interconnect (GGI), Underfill, Micro Bead Blasting, Laser Lift-Off and Electro Chemical Etch. 
  • Drive NPI, process development, process and product characterization, qualification, production pilot runs and volume ramp. 
  • Establish good process margins and inline controls. 
  • Perform yield analysis and lead troubleshooting and process excursions activities.
Job Requirements:
  • Degree / Master / PhD in E&E / Mechanical / Chemical Engineering, Physics, Chemistry or relevant disciple. 
  • 5 years of semiconductor experience. 
  • Prior experience in DA, Flip Chip bonding, overmold, TSV packaging, packaging substrate is preferred. 


The above information on this description has been designed to indicate the general nature, and level, of the work performed by this position. It is not designed to contain, or be interpreted, as a comprehensive inventory of all duties, responsibilities and qualifications required.

We invite interested candidates to write-in with CV in MS Word format to Ang Yu Ya (Avery), EA 12C6130/ R441765 We regret that only shortlisted candidates will be contacted for a discussion.

About Company

HPS Partners serve an international client base including early stage organisations and leading global corporations. Our assignments range from senior management appointments to experienced individual contributors.

HPS Partners believe the right people in the right jobs, allow synergies to create a strategy in sync with the dynamic marketplace, economy and competition. The right people are directly related to a seamless operating process that produces results. We help highly qualified senior executives achieve personal growth, job satisfaction and advancements. ​Please tell us a little about your professional experience and aspirations
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