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EA Licence: 11C3793

System Development Engineer (Semicon/Die Bond/Measurement Equipment)
Job Description: Systems & Process Engineering Participation in the development of hardware and software modules of Die Bond equipment for the semiconductor processing (analysis, modelling, calculation, measurement, qualification) Defining hardware and software requirements for interdisciplinary development team (mechanics, electronics, software, motion control) Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences Optimization of the Die Bonder system with the focus on accuracy, stability and productivity Development of "Die Bonding" process technologies according to customer requirements (analysis, modelling, calculation, measurement) Customer Support Support internal and external customers (occasional business travel) Support product management on customer projects Support manufacturing engineering on assembly and supplier issues Requirements: Degree qualified in related field such as microsystem technology, mechanical, electrical or mechatronic. Field experience in mathematics, mechatronic or material science Flair for practical work in the lab and with experience with measurement equipment Microsoft office and programming knowledge Good team player as well as initiative and independent contributor Innovative, systematic and solution-oriented work approach Flexible and able to work under pressure Ability to present complex topics in appropriate ways for specific audiences We regret that only shortlisted candidates will be notified. GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R110467 Contact Person: Tan, Wai Peng - Reg No:R1104671 (waipeng.tan@gmprecruit.com)    

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