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EA Licence: 11C3793

System Engineer ( Up $5k/ West )
► Semicon Industry ► Office Hour ► Working Location: Science Park Responsibilities: Participation in the development of hardware and software modules of "Die Bonder" equipment for the semiconductor industry (analysis, modelling, calculation, measurement, qualification) Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences Development of "Die Bonding" process technologies according to current or future customer requirements (analysis, modelling, calculation, measurement) Optimization of the Die Bonder system with the focus on accuracy, stability and productivity Support internal and external customers (occasional business travel) Definition of hardware and software requirements for an interdisciplinary development team (mechanics, electronics, software, motion control) Support product management on customer projects Support manufacturing engineering on assembly and supplier issues Interpretation, documentation and presentation of new results Requirements: Technical education at university. Ideally microsystem technology, mechanical, electrical or mechatronic Work experience in semiconductor or mechanical/electrical engineering or in a related field is advantageous Expertise in mathematics, mechatronic or material science Flair for practical work in the lab and with experience with measurement equipment Ability to present complex topics in appropriate ways for specific audiences Microsoft office and programming knowledge To apply, please visit to and search for Job Reference: 14722 To find out more about this opportunity, please contact Summer at We regret that only shortlisted candidates will be notified. GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Summer Thung | Registration No: R1871138 Contact Person: Thung, Summer - Reg.No:R1871138 (    

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