As an Advanced Packaging Technology Process Integration Engineer, be part of an exciting team working on cutting-edge advanced packaging process technologies. Develop and validate module process and integrate the solutions to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our partners taking them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and Integration process flow development to make sure projects are completed successfully and delivered on time.
This position is based in Singapore.
Applied Materials is committed to diversity in its workforce including Equal Employment Opportunity for Minorities, Females, Protected Veterans and Individuals with Disabilities.
- PhD or Master Degree ONLY - experienced in developing device drivers and embedded applications in supporting the semicon wafer, integrated circuit, and packaging production - experienced in C/C++, embedded Linux, RTOS, ARM, FPGA - PERM role
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