Advanced Packaging Technology Process Integration Engineer

Advanced Packaging Technology Process Integration Engineer

Applied Materials South East Asia Pte Ltd
Singapore
0 - 50 Years
Not Specified

Job Description

Job Description:

As an Advanced Packaging Technology Process Integration Engineer, be part of an exciting team working on cutting-edge advanced packaging process technologies. Develop and validate module process and integrate the solutions to enable advanced packaging process technologies in the world of mobile, IoT, consumer and high-performance computing area. Work with various teams from inside and outside of Applied Materials to help develop leading-edge packaging solutions for our partners taking them from concept to mass production. Responsibilities will include conducting gap-analysis, risk-assessment and mitigation, and Integration process flow development to make sure projects are completed successfully and delivered on time.

This position is based in Singapore.

Responsibilities:

  • Work on developing assembly process technologies for advanced System-in-Package, RDL, Hybrid Bonding and Heterogeneous Packaging solutions
  • Responsible for developing advanced 2.5D and 3D SiP MEOL and assembly flows
  • Module process, Measurement & Inspection to validate each process in integration
  • Develop process design kit (PDK) components to include various packaging processes
  • Manage complex technical programs and teams leading to timely development of products.
  • Interface with internal module process development, layout, package architecture, package design teams and with external suppliers, foundries, and OSATs for the development and realization of advanced packaging solutions

Experience:

  • Good understanding on Advanced Packaging architecture and process flow
  • Experience on MEOL & Packaging Assembly Process Integration
  • Experience on MEOL & Packaging Assembly unit Process (Reconstitution, Litho, Etch, CVD, PVD, Plating, Back Grinding, Dicing, Molding, P&P, Wire Bonding etc.)
  • Experience and Knowledge on various packaging technologies such as wire-bonding, flip-chip, camera-module assembly, molding, singulation, WLCSP, MCMs, and SiP
  • Good understanding on enabling high-density interconnects, associated mechanical, thermal and reliability issues and cost tradeoffs of various interposers process technologies
  • Good understanding on design manual, design rules, generation rules, parasitic extraction and PDK development associated workflow
  • Minimum 5 years of experience in semiconductor packaging/assembly/BEOL
  • Willing to tackle tough problems and enjoys problem solving. Comfortable in large corporate environments and can work with multi-functional teams across geographies
  • Requires BE or BS in Electrical, Mechanical, or Materials Science Engineering. MS/PhD preferred

Qualifications

Education:

Bachelor's Degree

Skills

Certifications:

Languages:

Years of Experience:

4 - 7 Years

Work Experience:

Additional Information

Travel:

Yes, 20% of the Time

Relocation Eligible:

No

Applied Materials is committed to diversity in its workforce including Equal Employment Opportunity for Minorities, Females, Protected Veterans and Individuals with Disabilities.

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