Package Development Engineer

Package Development Engineer

Stmicroelectronics Pte Ltd
5-7 years
50400 - 96000 SGD

Job Description

Job Description

  • Provide thermo-mechanical simulation to support IC package development for risk assessment in early design stage.
  • Lead / support new package DFM and structure characterization
  • Guide test vehicle development to improve simulation correlation to empirical data and failure mechanism, life prediction
  • Coordinate with supplier, external/internal customers for material characterization

Requirements

  • Bachelor's/ Master's Degree/ PhD in Mechanical/Material Engineering, Physics, or related discipline.
  • At least 5 years of experience in thermal mechanical modeling for IC package development.
  • Good knowledge on FEA modeling & simulation.
  • Hands-on experience on softwares such as Ansys, Abaqus etc.
  • A good understanding of semiconductor packaging processes, materials and technology.
  • Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
  • Experience on 3D CAD model etc is added advantage.
  • Good team player or capable to lead team for new package development.

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