r&d process engineer (wafer / die to wafer)

r&d process engineer (wafer / die to wafer)

4 - 7 Years
42000 - 69600 SGD

Job Description

job description
about the company
My client is a Swiss technology group with a focus on precious and special metals, medical technology, quartz glass, sensors and specialty light sources.With more than 20 years history, this is a great brand to join at an exicting time in their development.
about the job
  • Carry out Process Improvement Activities
  • Carry out Equipment & Process Buy Off
  • Machine installation and calibration
  • Machine Application Setup
  • Collects Process Data
  • Cleaning, plasma activation and annealing
  • Participate in the decision-making process for the acquisition of new equipment and systems to support innovative products
  • Provide technical advice, expertise, and troubleshooting training to existing & potential customers

skills & experience required
  • PhD / Masters in Material Sciences / Mechanical / Physics / Mechatronics / Electrnonics Engineering
  • Min 3 years of experience in R&D semiconductor manufacturing environment
  • Understand hybrid bonding ( wafer to die / wafer to wafer)
  • Six Sigma / JMP / Matlab experience
  • Well versed with semiconductor front end & backend process

If you are interested in the position , kindly send your CVs in to yitwei.kwan(@)randstad.com.sg
Please include your availability, expected salary and reason for leaving current job.
We regret that only shortlisted candidates will be contacted
EA: 94C3609 / Reg: R1325913
educational requirements
Master's Degree

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