Semicon Equipment Associate Engineer (Wirebond)

Semicon Equipment Associate Engineer (Wirebond)

People Profilers Pte Ltd
2 - 5 Years
Not Specified

Job Description

Job Description :
Job Description:
  • Refurbishment of Ball Bonder and Die Bonder machines, bond head and XY Table
  • Dismantle, adjusts, repairs and assembles equipment (e.g. bond head, XY Table, and other Ball Bonder modules) according to specification and drawings
  • Testing of Ball Bonder spares and visual inspectionprior to shipment
  • In-house processing of capillary screws & visual inspection

  • Requirement:
  • Minimum qualification of Vocational Certificate/NITEC in Electrical or Mechanical Engineering
  • Minimum experience of 2 years in the semiconductor industry
  • Possess basic knowledge of wire bonding and/or die bonding technology
  • Able to work independently to troubleshoot and analyze machines and spares issues when needed
  • Possess good written and communication skills
  • Proficient in Microsoft Office (Excel, PowerPoint and Words)

  • All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.
    Please email your resume in a detailed MS Word format to stating
    1) Current Drawn
    2) Expecting Salary
    3) Date Available
    4) Reason to Leave each job:
    We regret that only shortlisted candidates will be notified
    Joyce Koh Ai Leng
    People Profilers Pte Ltd,
    10 Anson Road #09-01/02 International Plaza
    Singapore 079903
    Tel: 6805 0868 Fax: 6835 7890
    EA License Number: 02C4944
    EA Personnel Reg nos R1110618
    Job Id: 33Y698

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